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Power Electronic Packaging

Design, Assembly Process, Reliability and Modeling

Autori

Viac o knihe

Focusing on power electronic packaging, this comprehensive guide explores key topics such as design, assembly, reliability, and failure analysis. It also emphasizes materials selection and incorporates advanced simulation and modeling techniques, making it an essential resource for professionals and researchers in the field.

Vydanie

Nákup knihy

Power Electronic Packaging, Yong Liu

Jazyk
Rok vydania
2012
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