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Power Electronic Packaging
Design, Assembly Process, Reliability and Modeling
Autori
Viac o knihe
Focusing on power electronic packaging, this comprehensive guide explores key topics such as design, assembly, reliability, and failure analysis. It also emphasizes materials selection and incorporates advanced simulation and modeling techniques, making it an essential resource for professionals and researchers in the field.
Variant knihy
2012, pevná
Nákup knihy
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