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Viac o knihe
This interdisciplinary tutorial is tailored for engineers in electronic packaging. Each chapter follows a uniform format, featuring schematics, problems, and solutions, while exploring the impact of various technologies across electrical, materials, chemical, and mechanical disciplines. Led by renowned author Tummala, it offers comprehensive insights.
Nákup knihy
Fundamentals of Microsystems Packaging, Rao Tummala
- Jazyk
- Rok vydania
- 2001
- product-detail.submit-box.info.binding
- (pevná)
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Doručenie
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