Kniha momentálne nie je na sklade
Parametre
Viac o knihe
Abstract The progress in the field of 3D integration of microeletronic systems enables a dependable and cost-effective density increase of ICs in a single package. The possibility to closely integrate heterogeneous ICs with different technologies and functionalities opens a way out of the “Memory/Processor Gap” via integration of scalable 3D stacked DRAMs with very high communication bandwidths and the corresponding logic (e. g. memory controller). In this way 3D integration of standard DRAMs with MPSoCs can largely improve the energy efficiency and increase the memory bandwidth.
Nákup knihy
Modelling, exploration and optimisation of 3D integrated DRAM and controller, Christian Weiss
- Jazyk
- Rok vydania
- 2014
Akonáhle sa objaví, pošleme vám e-mail.
Doručenie
Platobné metódy
Navrhnúť zmenu
- Titul
- Modelling, exploration and optimisation of 3D integrated DRAM and controller
- Jazyk
- anglicky
- Autori
- Christian Weiss
- Vydavateľ
- Techn. Univ.
- Vydavateľ
- 2014
- ISBN10
- 3943995674
- ISBN13
- 9783943995671
- Kategórie
- Skriptá a vysokoškolské učebnice
- Anotácia
- Abstract The progress in the field of 3D integration of microeletronic systems enables a dependable and cost-effective density increase of ICs in a single package. The possibility to closely integrate heterogeneous ICs with different technologies and functionalities opens a way out of the “Memory/Processor Gap” via integration of scalable 3D stacked DRAMs with very high communication bandwidths and the corresponding logic (e. g. memory controller). In this way 3D integration of standard DRAMs with MPSoCs can largely improve the energy efficiency and increase the memory bandwidth.